Asahi Glass | Materials for Semiconductor Processing

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Materials for Semiconductor Processing

	CMP Slurry Polishing Technologies for Planarised Multi-layer Structures	More Info.
	Asahi Glass CMP Slurries are the latest in state-of-the-art CMP Slurry technology. Asahi works closely with leading fabs to optimize slurry properties for custom processes. CMP processing using AGC's polishing slurries results in excellent surface planarity, uniformity and low defectivity on customer wafers.

CMP Slurry

CMP Process

Polished 8 inch Wafer
(Cu Interconnect Wafer)

Chemical Mechanical Polishing
Chemical Mechanical Polishing, or CMP, has quickly become an indispensable technique for fabricating integrated circuits. During the CMP process, a wafer surface is polished for planarization using a slurry and a polishing pad. The abrasive particles in the slurry grind against the sample surface, loosening material. The chemicals in the slurry then etch and dissolve the material. This process is designed to remove areas of elevated topography more quickly than the lower areas. Although mechanical grinding alone can achieve a reasonable degree of planarization, chemical etching is necessary to remove the extensive damage from mechanical grinding. Although chemical etching results in a damage-free sample, the process is typically isotropic and does not remove topographical features.

Schematic Drawing of Polished Structure

Ceria slurry for STI/ILD Applications
CES-300 Series
Asahi's Ceria-based slurry was developed for oxide layer polishing for STI and ILD applications. Key benefits with CES-300 Series slurries include narrow particle size distribution and superior dispersion technologies for less than 90nm node. These properties enable good slurry stability and superb process control. CES-300 series ceria slurry provides excellent planarization and very low defectivity on customer wafers. All CMP slurry products at Asahi Glass are alpha-tested at Asahi's world-class research center using the latest in semiconductor CMP process equipment.

Slurry for Cu/Barrier/Low-k Process
CL-1100, CL-1200, CL-2100
Asahi Glass CL-1100, CL-1200, and CL-2100 Series slurries were developed for the most demanding 90nm and 65nm low k/metal multilayer interconnect CMP processes. The CL-2100 Series slurries are designed to reduce dishing and erosion following copper polishing using our CL-1100 and/or CL-1200 Series Cu slurries. The CL Series slurries are designed for optimization of removal rates for TEOS, Ta, TaN, and SiOC layers. Our ability to customize the removal rate ratios of the various layers makes the CL-2100 Series slurry family unique in the industry.

All slurries on page are produced by Seimi Chemical Co., Ltd. and distributed by Asahi Glass Co., Ltd.

Seimi Chemical is a wholly-owned subsidiary of Asahi Glass Co., Ltd. Advanced technology platforms in organic and inorganic materials are Seimi's core assets. Seimi produces some of world's most leading-edge chemicals for the electronics, optics and pharmaceutical industries. Seimi's state-of-the-art quality control systems ensure the highest quality materials available in today's market.

SEIMI CHEMICAL CO., LTD.
(ISO 9001·2000, ISO 14001)